In the post-Moore era, what are some good precision cleaning and dust removal methods in the chip field?

In the post-Moore era, with the evolution of chip manufacturing processes to the nanoscale or even smaller scales, and the stringent requirements for chip performance in emerging application fields, people's demand for chip cleanliness has upgraded from the traditional "prevention of particle pollution" to the all-round pursuit of molecular-level pollution control, multi-dimensional environmental stability, and intelligent operation and maintenance management.

When the chip line width shrinks to 2 nanometers and below, traditional 0.1 micron

(100 nanometer) particles are enough to cause circuit short circuits or open circuits.

More importantly, molecular level contaminants (AMC, such as acidic gases and organic

vapors) will be adsorbed on the wafer surface, causing chemical corrosion or

electromigration, leading to a sharp decline in yield. For example, if one 0.1 micron particle

is added per cubic meter of air, the chip defect rate may increase by 1%-5%; while the

impact of molecular-level pollution may be more subtle but more deadly.

In order to solve the problem of fine dust, microorganisms and particles generated in the

semiconductor packaging and chip manufacturing processes, most companies use wet

cleaning. However, with the upgrading of my country's industry and the increasing

requirements for improving product yield, more and more companies are choosing dry

cleaning.

In the field of dry cleaning, cyclone non-contact dust removal equipment is favored by

many leading companies.

Non-contact dust removal equipment can carry out ultra-fine precision clean dust removal

for flat, micro-device, special-shaped, concave and convex products, and products with

step differences.

For example, for electronic devices - mobile phone camera lens/lens barrel/module/VCM/CMOS

and other devices; semiconductor packaging - CHIP, FBGA, FCBGA and other packaging

components; medical cosmetics - non-contact precision cleaning and dust removal of

medical equipment and cosmetic containers.

The non-contact dust removal equipment uses an upgraded and customized high-rotation

shaft and spiral air nozzle, and is arranged based on years of field experience and

accumulated air flow simulation algorithms. It can be set and used according to different

usage scenarios of users. Users can add non-contact dust removal equipment to the new

process production line, or install cyclone module units at necessary nodes in the original

process equipment, which can achieve the good effects of upgrading and improving the

original cleanliness, increasing yield, reducing labor, and increasing efficiency.

For more precision clean dust removal solutions, please consult Dongkai Semiconductor