The type corresponding to micro devices refers to precision non-contact dust removal and cleaning
of smaller-sized devices and components. For example, for electronic devices - mobile phone camera
lens/lens barrel/module/VCM/CMOS and other devices; semiconductor packaging - CHIP, FBGA,
FCBGA and other packaging components; medical cosmetics - non-contact precision cleaning of
medical equipment and cosmetic containers.
The design of the micro device corresponding cyclone module head is based on the ordinary flat
type (see the flat type product introduction). In order to meet the higher precision dust removal
and cleaning requirements of micro and small products, it uses an upgraded and customized
high-rotation shaft and spiral air nozzle, and is arranged based on years of field experience
and accumulated air flow simulation algorithms. It can be set and used according to different
usage scenarios of users. Users can add cyclone cleaning equipment to the new process production line, or install cyclone module units at necessary nodes in the original process equipment, which can achieve good results of upgrading and improving the original cleanliness, increasing yield, reducing labor, and increasing efficiency.
The micro-device-compatible type has been applied in industries such as mobile phone cameras,
semiconductor packaging, medical and beauty packaging, etc., and has been well received by
leading companies in the industry and its industrial chain. For specific information, please refer
to the case introduction section, or contact us directly for consultation.

Cleaning parameters of micro device-compatible cyclone ultra-high precision dust removal module equipment:
Cyclone non-contact cleaning equipment
Dust removal method: non-contact
Cleaning accuracy: 10?(99%↑), 5?(90%↑), ≤5?(88%↑)
Cleaning length: 50-100mm (optional)
Cleaning width: 50-66mm
Height of being cleaned: 8-40mm
Cleaning speed: 800mm/Sec Max
Operating air supply pressure: 0.25~0.4mPa

Cyclone ultra-precision dust removal and foreign matter removal equipment is an ultra-precision
non-contact cleaning equipment that is currently used by leading companies in precision electronic
manufacturing, medical cosmetics, new energy materials and other fields.
Suitable for product manufacturing processes with strict process requirements
The effect of replacing previous dust removal methods such as air knife, vacuum, ultrasonic, and
ion is insufficient.
It has an efficient cleaning effect not only on flat surfaces, but also on concave and convex surfaces
and three-dimensional surface components.
Improve cleanliness, improve yield, and save labor.
Many application achievements among industry leading companies and their industrial chain
companies
Years of experience in process upgrading and improvement, a variety of customized selection
products for cyclone module components
Technology: Cleaning of adhesive and slightly sticky foreign matter, non-contact dry dust removal
cleaning
Equipment: XJDC cyclone dry cleaning module equipment